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Application of the transient dual interface method in test based modeling of heat-sinks aimed at socketable LED modules

机译:瞬态双界面方法在锁温槽的基于测试中的应用中的应用

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This paper presents a method of thermal characterization of heat-sinks aimed at cooling socketable LED modules. The suggested measurement procedure resembles the transient dual interface method of the JEDEC JESD51-14 standard: two transient measurements are performed with different qualities of the thermal interface of the heat-sink surface mating the LED modules. The structure functions section identified with such a measurement represents solely the measured heat-sink. Step wise approximation of the obtained structure function section is used to create DCTMs of the heat-sinks, aimed at fast system level simulations of LED modules.
机译:本文介绍了一种旨在冷却插座LED模块的散热器的热表征方法。建议的测量程序类似于JEDEC JESD51-14标准的瞬态双接口方法:使用LED模块的散热器表面的热界面的不同质量来执行两个瞬态测量。用这种测量标识的结构函数部分仅代表测量的散热器。所获得的结构函数部分的步骤明智近似用于创建散热器的DCTM,旨在LED模块的快速系统级模拟。

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