condensation; failure analysis; sodium compounds; solders; ECM; FR4 substrate; NaCl crystal effect; THB test; condensation cores; condensation intensity; dew point test; electrochemical migration processes; failure phenomena; lead bearing; lead-free solder alloys; locally water bridges; thermal-humidity bias; water condensation process; water droplets; Conductors; Crystals; Electronic countermeasures; Ions; Lead; Reliability; dew point test; electrochemical migration; water condensation;
机译:在FR4和聚酰亚胺基材的情况下水的凝结对电化学迁移的影响
机译:NaCL溶液下印刷电路板电化学迁移失效的寿命模型
机译:NaCl污染的环境测试中Ni和ENIG表面光洁度的电化学迁移
机译:NACL对水凝结和电化学迁移的影响
机译:超临界水海水淡化:模型预测的NaCl浓度比较
机译:分析溶液效应的伤害。用于计算三元体系NaCl-二甲基亚砜-水和NaCl-甘油-水的相图信息的方程式。
机译:NaCl污染的环境测试中Ni和ENIG表面光洁度的电化学迁移