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The effect of NaCl on water condensation and electrochemical migration

机译:NaCl对水冷凝和电化学迁移的影响

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The effect of NaCl crystals on water condensation and on electrochemical migration processes (ECM) were investigated in case of different lead bearing and lead-free solder alloys on FR4 substrate during a special Thermal-humidity Bias (THB) test, called dew point test. The dew point test simulated the water condensation process and ECM, which processes were followed by in-situ optically and simultaneously electrically as well. The results showed that NaCl crystals can accelerate the condensation intensity, hence they played role as condensation cores. Furthermore, water droplets have formed locally “water bridges” between adjacent conductor lines. On the other hand, after the dissolution of NaCl crystals the ECM processes were accelerated. Finally precipitates and dendrites were formed resulted in shorts.
机译:在特殊的热湿偏压(THB)测试(称为露点测试)中,研究了FR4基板上含铅和无铅焊料合金不同的情况下,NaCl晶体对水凝结和电化学迁移过程(ECM)的影响。露点测试模拟了水的凝结过程和ECM,随后在光学和电学方面同时进行了原位跟踪。结果表明,NaCl晶体可以加速凝结强度,因此起着凝结核的作用。此外,水滴在相邻的导线之间局部形成了“水桥”。另一方面,NaCl晶体溶解后,ECM过程加速了。最终形成沉淀物和枝晶,导致短路。

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