UHF filters; VHF filters; band-pass filters; barium compounds; electronics packaging; filled polymers; microstrip filters; polymer films; printed circuit manufacture; BaTiOsub3/sub; DGS; PCB manufacturing process; communication systems; cross coupled microstrips; double helical ground structure; electric device; electrical system miniaturization; electronic system miniaturization; embedded compact-polymer film VHF band-pass filter; epoxy composite film; frequency 280 MHz to 400 MHz; high frequency selectivity; low insertion loss; multilayered FR-4 packaging substrate; power plane; return loss; Band-pass filters; Films; Insertion loss; Loss measurement; Microwave filters; Resonator filters; Substrates; BaTiO3-epoxy composite film; band-pass filter; defect ground structure; embedded filter;
机译:BaTiO
机译:<!“
机译:Si(100)上集成的BaTiO
机译:嵌入式紧凑型BATIO
机译:使用右/左复合蜂窝的新型紧凑型窄带带通滤波器的无线应用开发
机译:BaTiO3填料的粒径对电容器储能应用BaTiO3 /聚合物/ Al薄膜的制备和介电性能的影响
机译:电场诱导的(Bi