Alternative flip chip sample preparation technique using triple ion beam milling

摘要

This paper describes an alternative cross-section sample preparation approach using triple ion beam (TIB) milling to prepare flip chip samples. The 3 cases study results clearly demonstrate the capability and advantages of TIB milling for preparing Lead-free and eutectic C4 solder bumps and back-end-of-line (BEOL) defects as compared to conventional mechanical and Focus Ion Beam (FIB) cross-section.