cooling; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; lead bonding; chip-to-chip interconnect; chip-to-interposer interconnect; chip-to-substrate interconnect; cooling; heating; thermal uniformity; thermocompression flip chip bonding; ultrafine pitch flip chip technology; Bonding; Cooling; Films; Heating; Stress; Temperature sensors; Throughput;
机译:倒装芯片装配工艺的成本分析:毛细管底部填充的质量回流和非导电膏的热压粘合
机译:热压倒装芯片接合的建模和评估标准
机译:热压倒装芯片接合的建模和评估标准
机译:先进的热压倒装芯片粘合
机译:无助焊剂倒装芯片键合工艺和空中无助焊剂键合技术。
机译:带有毛细管自组装的氧化物-氧化物热压直接键合技术用于多芯片至晶圆异质3D系统集成
机译:吞吐量增强的倒装芯片到晶圆键合:先进的芯片到晶圆键合