aluminium; ball grid arrays; copper; integrated circuit bonding; integrated circuit packaging; integrated circuit reliability; lead bonding; Cu-Al; HTS; PBGA package; TC; ball bond integrity; ball bond strength performance; ball shear tests; capillary touchdowns; extreme loop height; insulated wire bonding process; manufacturability readiness; microelectronics devices; organic coating; reliability stressing; stitch bond integrity; stitch pull tests; touched wires profile; ultra fine pitch wire bonding; unbiased HAST; wire crossing; wire density; wire pull tests; wire sweeping issues; wire touching; wire-to wire short issues; Bonding; Gold; High-temperature superconductors; Microelectronics; Reliability; Testing; Wires;
机译:PBGA封装的高频引线键合,一种工艺优化方法
机译:微电子封装中金,铜线键合和悬垂键合的界面特性及动力学过程
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机译:PBGA封装中绝缘Cu线粘结工艺的可制造性准备
机译:使用Cu-Cu直接键合的3D微电子封装中的热机械问题及其解决方案。
机译:双丝电弧增材制造工艺沉积Al-Cu-Sn合金壁的组织与力学性能研究
机译:微电子引线与绝缘AU线粘合:工艺参数对绝缘拆卸和新月结合的影响