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Integrated Optocoupler Circuit Design in High Voltage Bipolar-CMOS-DMOS Process

机译:高压双极-CMOS-DMOS过程中集成的光耦合器电路设计

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Optocouplers comprising an optical sensor and electrical readout circuits are commonly fabricated on a single chip to reduce the size of electrical systems and enlarge circuit board capacity. Nonetheless, the inclusion of two separate components on a single chip still results in high cost and area overhead exceeding those of monolithic chips. In this paper, we propose an optocoupler integrating an optical sensor and readout circuit on a single chip using the TSMC high voltage bipolar-CMOS-DMOS (BCD) process. The combination of high current bipolar junction transistors with this mature CMOS processing technology makes such a monolithic chip achievable and the reduced chip size greatly expands its applicability. This approach to circuit integration also helps to enhance the reliability of the resulting chip, while reducing the overall costs and facilitating mass production.
机译:包括光学传感器和电读出电路的光耦合器通常在单个芯片上制造,以减小电气系统的尺寸并放大电路板容量。尽管如此,在单个芯片上包含两个单独的组件仍然导致高成本和面积开销超过整体芯片。在本文中,我们提出了一种光耦合器,使用TSMC高压双极 - CMOS-DMOS(BCD)工艺将光传感器和读出电路集成在单个芯片上。具有这种成熟的CMOS加工技术的高电流双极结晶体管的组合使得这种单片芯片可实现,并且芯片尺寸的降低极大地扩展其适用性。这种电路集成方法还有助于提高所得芯片的可靠性,同时降低总成本和促进批量生产。

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