Chip-to-rectangular waveguide transition realized in embedded Wafer Level Ball Grid Array (eWLB) package

摘要

In this paper, we present for the first time the realization of a 77 GHz chip-to-rectangular waveguide transition realized in an embedded Wafer Level Ball Grid Array (eWLB) package. The chip is contacted with a coplanar waveguide (CPW). For the transformation of the transverse electromagnetic (TEM) mode of the CPW line to the transverse electric (TE) mode of the rectangular waveguide an insert is used in the eWLB package. This insert is based on radio-frequency (RF) printed circuit board (PCB) technology. Micro vias formed in the insert are used to realize the sidewalls of the rectangular waveguide structure in the fan-out area of the eWLB package. The redistribution layers (RDLs) on the top and bottom surface of the package form the top and bottom wall, respectively. We present two possible variants of transforming the TEM mode to the TE mode. The first variant uses a via realized in the rectangular waveguide structure. The second variant uses only the RDLs of the eWLB package for mode conversion. We present simulation and measurement results of both variants. We obtain an insertion loss of 1.5 dB and return loss better than 10 dB. The presented results show that this approach is an attractive candidate for future low loss and highly integrated RF systems.