UItra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages

摘要

In this study, ultra fine 2/2um LW/LS with 3-layer RDL was demonstrated and characterized in eWLB technology. It also passed JEDEC component level reliability test results. It provides high density interconnection such as die-to-die connects or high 10 applications, such as graphics, network or high performance devices. It would be a critical factor for next generation wafer level packaging, including 2.5D/3D integration. Advanced packaging plays a crucial role in driving products with increased performance, low power, lower cost and smaller form factor. There are many challenges that have been and are being resolved in the application of cost effective materials and processes for various reliability and security requirements. The industry requires innovation in packaging technology and manufacturing to meet current and forecasted demands and the ability to operate equipment in high volume with large throughput.