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The Research of Iterative Learning Control Method on Linear Voice Coil Motor and Application in Flip Chip

机译:线性音箱电机迭代学习控制方法研究及倒装芯片应用

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In this paper.. we report the research of iterative learning control method on linear voice coli motor and application in flip chip. As the flip chip technology has realized minimun size- package. excellent electric performance and thermal characteristics, it is suitable for mass production and high-density package. The process usually includes two different kinds of movement under the high speed and high acceleration circumstance. so the linear voice coil motor (VCM) was chosen as its drive. In the 'pick' process, the iterative learning control method was proposed to improve the precision: an the 'place'process of flip chip. a new soft landing method was proposed to realize low contact force. and the motion track is optimized. The application result in IC packaging and assembly equipment proved the effectiveness of the control method
机译:在本文中..我们报告了对倒装芯片线性语音大肠杆菌电机的迭代学习控制方法研究。随着倒装芯片技术实现了最小的尺寸包装。优异的电性能和热特性,适用于大规模生产和高密度封装。该过程通常包括在高速和高加速度环境下的两种不同类型的运动。因此,选择线性音圈电机(VCM)作为其驱动器。在“挑选”过程中,提出了迭代学习控制方法来提高精度:倒装芯片的“倒装芯片的Place'Process”。提出了一种新的软着陆方法来实现低接触力。并且运动轨道被优化。 IC包装和装配设备的应用结果证明了控制方法的有效性

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