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Influence of crack growths on the performances of cantilever based MEMS devices: Design and simulations

机译:裂纹扩展对基于悬臂的MEMS器件性能的影响:设计和仿真

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There is a great need to design experimental setup to deal with the fundamental material issues in MEMS. Cantilever being the active part of MEMS is modeled using COMSOL Multiphysics. The model is simulated for small cracks ranging from Nano to Micro-meter. The cracks are produced at the anchor of MEMS device subjected to variations in Eigen frequencies, Stress levels and Tip displacements of cantilever beam and is measured in association with crack growths. These factors are simulated in order to predict the ultimate lifetime in the form of total number of cycles to failure in association with variations in applied stress levels and with the help of Statistical distribution and Paris's law. The Paris's law is utilized by integrating it between the upper and lower limits (crack sizes) that results in predicting the useful lifetime of the cantilever based MEMS device. The simulated results show that at resonance frequency the probability of crack growth is less due to its stress-less and free vibration. The tip displacement of the cantilever also contributes in deterioration in resonance frequency. Moreover, periodically increase in applied stresses result in rapid crack growth.
机译:迫切需要设计实验装置来解决MEMS中的基本材料问题。悬臂是MEMS的活跃部分,是使用COMSOL Multiphysics建模的。该模型针对从纳米到微米的小裂纹进行了仿真。裂纹在MEMS设备的锚点处产生,该裂纹会受到本征频率,应力水平和悬臂梁尖端位移的变化的影响,并与裂纹扩展相关联地进行测量。模拟这些因素是为了预测最终的使用寿命,其形式是与施加的应力水平的变化相关联,并借助统计分布和巴黎定律来确定失效的总次数。通过将巴黎定律整合到上限和下限(裂缝尺寸)之间,从而预测基于悬臂的MEMS器件的使用寿命。仿真结果表明,在共振频率下,由于无应力和自由振动,裂纹扩展的可能性较小。悬臂的尖端位移也导致共振频率的下降。而且,施加应力的周期性增加会导致裂纹快速增长。

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