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Design Simulation and Analysis of U-Shaped and Rectangular MEMS Based Triple Coupled Cantilevers

机译:基于U形和矩形MEMS的三重耦合悬臂的设计仿真和分析

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摘要

In this paper, we have proposed a new shape Micro-Electromechanical Systems (MEMS) based triple coupled Cantilever sensor, named as U-Shaped Cantilever. We have designed and simulated a U-Shaped MEMS based micro-cantilever made up of P-Silicon (Polycrystalline, Lightly doped) in COMSOL multiphysics. U-Shaped single beam Cantilever is designed with the dimensions of 100μm*20μm*2μm. U-shaped triple coupled Cantilever is designed with the dimensions of 20μm*120μm*2μm, 100μm*20μm*2μm. The simulation results like displacement, Eigen-frequency, surface stress, temperature, measurements of the U-shaped triple coupled cantilever is compared with rectangular triple coupled cantilever.
机译:在本文中,我们提出了一种新型的基于微机电系统(MEMS)的三重耦合悬臂传感器,称为U形悬臂。我们已经在COMSOL多物理场中设计并模拟了一个由P型硅(多晶,轻掺杂)组成的基于U型MEMS的微悬臂梁。 U型单光束悬臂设计尺寸为100μm*20μm*2μm。 U形三重耦合悬臂设计尺寸为20μm*120μm*2μm,100μm*20μm*2μm。将U型三重耦合悬臂的位移,本征频率,表面应力,温度,测量结果等仿真结果与矩形三重耦合悬臂进行了比较。

著录项

  • 来源
    《Journal of Scientific & Industrial Research》 |2017年第4期|235-238|共4页
  • 作者单位

    Department of ECE, KL University, Green Fields, Vaddeswaram-522502 AP, India ,Department of Instrument Technology, College of Engineering, Andhra University, Visakhapatnam AP, India;

    Department of ECE, KL University, Green Fields, Vaddeswaram-522502 AP, India;

    School of Electronics Engineering (SENSE), VIT University, Vellore, Tamil Nadu India;

    Department of Instrument Technology, College of Engineering, Andhra University, Visakhapatnam AP, India;

  • 收录信息 美国《科学引文索引》(SCI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    MEMS; Surface Stress; Eigen Frequency; Sensor; Triple Coupled Cantilever;

    机译:MEMS;表面应力本征频率;传感器;三重耦合悬臂;

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