A comparison of wafers sawn by resin bonded and electroplated diamond wire — From wafer to cell

摘要

In this work we investigated the wafer quality from wafer process to cell process. These wafers were sawn by two types of diamond wire. The difference between the two types of diamond wires is the bonding layer — resin bonded and electroplated. To investigate the wafers' quality, few wafers are taken to test the breakage strength with bending test. We observed the wafer morphology with SEM. The subsurface damage was observed with TEM and Raman spectroscopy. At last wafers were made to cells for electrical performance verification.