Heated area measurement and analysis of optical setups for focused IR light soldering system

摘要

In this paper, an experimental study of four optical setups used for developing a Focused IR Light Soldering System (FILSS) for Surface Mount Technology (SMT) lead free electronic devices, specifically Ball Grid Arrays (BGA), is presented. The results of this work show captured images of light distribution at the surface area of the BGA under soldering process, compared with the temperature distribution achieved from the proposed optical setups. An analysis of peak temperature and thermal distribution uniformity at the surface of a BGA is presented for each one of the proposed optical setups.