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Si ICL based Si{sub}3N{sub}4 passivation on InAlAs surface of InP-HEMT by RPECVD System

机译:基于SI ICL的SI {SUB} 3N {SUB} 4钝化RPECVD系统INP-HEMT的表面

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As a promising device for high speed communication, HEMT has got many intention. But, it is long way to field-application of HEMT because of instability of the device. Especially, surface of InP-HEMT (InAIAs) is very unstable and bandgap of InP is narrower than conventional GaAs-HEMT, so kink effect is very severe consequently. Si ICL (Inter Control Layer) based SiN passivation for GaAs-HEMT has been suggested before, and I applied it to the InP-HEMT passivation process. It showed that Si ICL based passivation was more effective for reducing surface state.
机译:作为高速通信的有希望的设备,HEMT有很多意图。但是,由于设备的不稳定性,它是悬臂的远场应用。特别地,InP-HEMT(INAIAS)的表面非常不稳定,INP的带隙比传统的GaAs-HEMT窄,因此后果扭曲效果非常严重。基于SI ICL(控制层间)基于GAAS-HEMT的SIN钝化,并施加到INP-HEMT钝化过程。它表明,基于ICL的钝化更有效地降低了表面状态。

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