SMD Components Assembly on a Flexible Substrate by Non-Conductive Adhesives

摘要

This paper presents SMD components assembly by non-conductive adhesives. Two types of non-conductive adhesives were used for the experiment - UV curable acrylic adhesive Loctite AA3926 and two-part epoxy adhesive Loctite HY4092 GY. The purpose of the experiment was to achieve good mechanical and electrical properties of the joint between the SMD component and copper pads made on flexible DuPont Kapton foil. The electrical conductivity was achieved only by mechanical contact of the component and substrate pads. Therefore, the mechanical pressure on the component during curing was important just as the adhesive's shrinkage rates. Also, the adhesive's amount causes a noticeable joint property modification. The assembly of the SMD components by non-conductive adhesives was comparable with quite commonly used conductive adhesives within the electrical and shear strength mechanical properties.