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Characterization of HfO2 on Hafnium-Indium-Zinc Oxide HIZO layer metal-insulator-semiconductor structures deposited by RF sputtering

机译:RF溅射沉积的HFO 2 在氧化铪 - 氧化锌的氧化锌氧化锌层金属绝缘体 - 半导体结构上的表征

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The electrical properties of RF magnetron sputtered HfO layers as dielectric and Hafnium-Indium-Zinc-Oxide HIZO as semiconductor in metal-insulator-semiconductor (MIS) structures are investigated. The dielectric constant of the HfO layer was around 9 measured at 10 kHz. The critical electric field was higher than 5×10 V/cm and the leakage current below 5×10 A/cm. The effective charged density of interface states in the order of 5×10 cm. Flat band shift due to polarization of the dielectric at voltage rage between -5 and 5 V is below 0.5 V. The RF deposited HIZO layer presents higher density of interface and bulk traps than similar layers deposited by other more complex techniques requiring higher processing temperature. However, results indicate that they can still be used in low voltage range amorphous oxide semiconductor thin film transistors AOSTFTs.
机译:研究了RF磁控溅射HFO层作为金属 - 绝缘体 - 半导体(MIS)结构中的半导体作为介电和铪铟 - 氧化锌氧化物的电学特性。 HFO层的介电常数在10kHz下测量约9。临界电场高于5×10V / cm,漏电流低于5×10a / cm。界面状态的有效充电密度为5×10cm。由于电介质在-5和5V之间的电压峰值的偏振导致的扁平带频率低于0.5V .RF沉积的Hizo层的界面密度和散装阱的密度高于所需的其他更复杂的技术需要更高的加工温度的层。然而,结果表明它们仍然可以用于低电压范围非晶氧化物半导体薄膜晶体管烘烤器。

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