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Uniqueness of hydride vapour phase epitaxy in optoelectronic device fabrication

机译:光电器件制造中氢化物气相外延的唯一性

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Non-equilibrium techniques like MOVPE (metal organic vapour phase epitaxy) and MBE (molecular beam epitaxy) have gained momentum owing to their ability to grow layers of only a few nm thickness with good uniformity in thickness and composition and good reproducibility. These processes are known to be operating under diffusion or kinetically controlled conditions. The increasing complexity of the modern discrete and integrated optoelectronic devices puts demand not only on the thin basic quantum structures but also on the following: (i) realisation of thick layers; (ii) selective regrowth of thick semi-insulating current confinement layers (/spl ap/5 /spl mu/m) in high speed device fabrication to minimise parasitics; (iii) flexible means to achieve selective regrowth of semi-insulating layers around both [110] and [110] directional mesas individually or simultaneously (cross mesas); such a demand will be felt more and more when the demand on integration is even more acute and (iv) selective regrowth of semi-insulating layers around parallelepiped and cylindrical mesas in the fabrication of VCSELs (vertical cavity surface emitting layers); the surrounding semi-insulating layers will be essential for current confinement, effective thermal dissipation and high speed operation. In this invited paper we intend to show that the above demands can be easily met with by hydride vapour phase epitaxy (HVPE). Yet another related technique chloride vapour phase epitaxy (Cl-VPE) also operates with the same essential principles as HVPE. Hence what is applicable to HVPE is also applicable to Cl-HVPE.
机译:非平衡技术,如MOVPE(金属有机气相外延)和MBE(分子束外延)由于其能够在厚度和组成和良好的均匀性和良好的再现性和良好的再现性而增加的能力而产生动量。已知这些过程在扩散或动力控制条件下操作。现代离散和集成光电器件的越来越多的复杂性不仅对薄的基本量子结构表示需求,而且还提出以下内容:(i)实现厚层; (ii)高速装置制造中的厚半绝缘电流限制层(/ SPL AP / 5 / SPCU / M)的选择性再生,以最小化寄生菌素; (ⅲ)灵活的手段来实现围绕半绝缘层的选择性再生长都[110]和[110]方向的台面单独或同时(交叉台面);当对vcsels的制造时,当对整合的需求更为急性和(iv)在平行六面体和圆柱形台面上的半绝缘层的选择性再生(垂直腔表面发射层)时,将越来越多地感受到这种需求。周围的半绝缘层对于电流限制,有效的热耗散和高速操作至关重要。在这份邀请的论文中,我们打算表明可以通过氢化物气相外延(HVPE)轻松满足上述要求。另一个相关的技术氯化物气相外延(CL-VPE)也与HVPE相同的必需原理。因此,适用于HVPE的内容也适用于CL-HVPE。

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