首页> 外文会议>Annual SEMI Advanced Semiconductor Manufacturing Conference >On the generation and elimination of lonely poly-silicon crater-defects and their impacts on gate oxide integrity (GOI) in dual-gate technology
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On the generation and elimination of lonely poly-silicon crater-defects and their impacts on gate oxide integrity (GOI) in dual-gate technology

机译:关于双栅技术中孤独多晶硅缩孔缺陷的产生和消除及其对栅氧化完整性(GOI)的影响

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摘要

The various observations of poly-silicon (poly-Si) crater-defects and their impacts on the gate oxide integrity (GOI) in a dual-gate technology were first described. The electrochemical kinetics of selectively corroding poly-silicon has been elucidated for the first time in generating lonely crater-defects into the unnoticeable spots of damage due to the intermittent micro-arcing events during implantation. By largely shunting the electrochemical corrosion process in a weak electrolyte (HF), the crater-defects in poly-silicon have been eliminated for significantly improving the gate oxide integrity.
机译:首先描述了在双栅技术中多晶硅(poly-Si)火山口缺陷的各种观察结果及其对栅氧化完整性(GOI)的影响。首次阐明了选择性腐蚀多晶硅的电化学动力学,这是由于在植入过程中间歇性的微弧焊事件而在不明显的损伤点产生了孤独的陨石坑缺陷。通过在弱电解质(HF)中大量分流电化学腐蚀过程,已消除了多晶硅的缩孔缺陷,从而显着提高了栅极氧化物的完整性。

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