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Parylene etching techniques for microfluidics and bioMEMS

机译:微流体和生物素的聚丙烯蚀刻技术

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Parylene C (poly(monochloro-p-xylylene)) is a member of a unique family of thermoplastic, crystalline polymers. Compared to other polymers, parylene films are exceptionally conformal and chemically inert owing to its vapor deposition polymerization (VDP) coating process. These properties bring about many interesting possibilities for MEMS, particularly in microfluidic and bioMEMS applications. Dry etching techniques are required to define fine features in parylene films. For the first time, selective parylene C removal using oxygen-based plasmas is characterized for plasma etching, reactive ion etching (RIE), and deep reactive ion etching (DRIE) based methods. The ability of these techniques to achieve high aspect ratio (HAR) structures desirable for MEMS applications is also investigated.
机译:聚苯乙烯C(聚(单氯-P- Xylylene)是独特的热塑性晶体聚合物的成员。与其他聚合物相比,由于其气相沉积聚合(VDP)涂布方法,聚对二甲苯薄膜在异常和化学上惰性。这些性质为MEMS带来了许多有趣的可能性,特别是在微流体和生物美容应用中。需要干蚀刻技术来定义聚对二甲苯薄膜的细胞细胞。首次使用基于氧等离子体的选择性聚苯乙烯C去除的特征在于等离子体蚀刻,反应离子蚀刻(RIE)和基于深反应离子蚀刻(DRIE)的方法。还研究了这些技术实现了对MEMS应用期望的高纵横比(HAR)结构的能力。

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