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SILICON WET ETCHING METHOD USING PARYLENE MASK AND METHOD OF MANUFACTURING NOZZLE PLATE OF INKJET PRINTHEAD USING THE WET ETCHING METHOD
SILICON WET ETCHING METHOD USING PARYLENE MASK AND METHOD OF MANUFACTURING NOZZLE PLATE OF INKJET PRINTHEAD USING THE WET ETCHING METHOD
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机译:利用聚对二甲苯掩膜的硅湿法提取方法和利用湿法提取法制造喷墨打印头喷嘴板的方法
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摘要
A silicon wet etching method using a parylene mask and a method for manufacturing a nozzle plate of an inkjet printhead using the same are provided to minimize thermal defects inside of a silicon substrate generated by a thermal oxidization process by reducing the number of thermal oxidization processes for the silicon substrate. A silicon wet etching method using a parylene mask includes the steps of forming a first etching mask made of a parylene on a surface of a silicon substrate(200'), forming a first element by primarily wet etching the silicon substrate by using the first etching mask, forming a second etching mask made of a silicon oxidization film on the surface of the silicon substrate, and forming a second element by secondly wet etching the silicon substrate by using the second etching mask, wherein the silicon wet etching method forms at least two elements having a shape different from each other on the silicon substrate by at least two wet etching processes.
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