SILICON WET ETCHING PROCESS USING PARYLENE MASK AND METHOD FOR PRODUCING NOZZLE PLATE OF INK JET PRINTHEAD USING THIS PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a silicon wet etching process using a parylene mask.;SOLUTION: The silicon wet etching process using a parylene mask comprises the steps of: forming a primary etching mask comprising parylene on a surface of a silicon substrate; forming a first element by subjecting the silicon substrate to a primary wet etching using the primary etching mask, forming a secondary etching mask comprising silicon oxide film on the surface of the silicon substrate; and forming a second element by subjecting the silicon substrate to a secondary wet etching using the secondary etching mask.;COPYRIGHT: (C)2007,JPO&INPIT