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A parallel iterative layered-medium integral-equation solver for electromagnetic analysis of electronic packages

机译:一种平行迭代分层介质积分方程求解器,用于电子封装的电磁分析

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A parallel iterative solver for multiport network parameter extraction of large-scale electronic packages is presented. The proposed solver is based on a frequency-domain integral-equation formulation that accounts for the substrate using planar layered-medium Green's functions, conductor loss/ roughness using an impedance boundary condition, and port truncations using a non-radiating lumped port model. The parallel iterative solution is accelerated by a sparse preconditioner and an FFT-based matrix-vector multiplication algorithm. A scalability study demonstrates the solver's suitability for analyzing high-fidelity and large-scale package models.
机译:提出了一种用于多端口网络参数提取的平行迭代求解器,用于大规模电子包装的提取。所提出的求解器基于频域积分式制构,其使用平面层介质绿色的函数,使用阻抗边界条件的导体损耗/粗糙度以及使用非辐射集成端口模型的端口截短。并行迭代解决方案通过稀疏的预处理器和基于FFT基矩阵 - 矢量乘法算法加速。可扩展性研究展示了求解器的适用性,用于分析高保真和大规模包装模型。

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