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A parallel iterative layered-medium integral-equation solver for electromagnetic analysis of electronic packages

机译:用于电子封装电磁分析的并行迭代分层介质积分方程求解器

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A parallel iterative solver for multiport network parameter extraction of large-scale electronic packages is presented. The proposed solver is based on a frequency-domain integral-equation formulation that accounts for the substrate using planar layered-medium Green's functions, conductor loss/ roughness using an impedance boundary condition, and port truncations using a non-radiating lumped port model. The parallel iterative solution is accelerated by a sparse preconditioner and an FFT-based matrix-vector multiplication algorithm. A scalability study demonstrates the solver's suitability for analyzing high-fidelity and large-scale package models.
机译:提出了一种用于大规模电子封装多端口网络参数提取的并行迭代求解器。提出的求解器基于频域积分方程公式,该公式考虑了使用平面分层中格林函数的基板,使用阻抗边界条件的导体损耗/粗糙度以及使用非辐射集总端口模型的端口截断。并行迭代解决方案通过稀疏预处理器和基于FFT的矩阵矢量乘法算法来加速。可伸缩性研究证明了求解器适用于分析高保真和大规模包装模型。

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