首页> 外文会议>International Workshop on Thermal investigations of ICs and Systems >Study on thermal performance of high power LED employing aluminium filled epoxy composite as thermal interface material
【24h】

Study on thermal performance of high power LED employing aluminium filled epoxy composite as thermal interface material

机译:高功率LED的热性能研究采用铝填充环氧复合材料作为热界面材料

获取原文

摘要

The demand for high power light emitting diodes (LEDs) has spawned a dramatic revolution in illumination industry. However, the miniaturization of electronic devices especially LEDs have increased the need for highly sophisticated yet cost effective thermal management solutions in order to sustain this technological advancement. This paper elucidates the thermal behaviour of an LED employing metal filled polymer matrix as thermal interface material (TIM) for an enhanced heat dissipation characteristic. Highly thermal conductive aluminium were incorporated in bisphenol A diglycidylether (DGEBA) epoxy matrix to identify the effect of filler to polymer ratio on the thermal performance of high power LEDs. The curing behaviour of DGEBA was optimized by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The dispersion nature of the Al fillers into polymer matrix was verified with Field Emission Scanning Electron Microscope (FESEM). The thermal performance of synthesized Al filled polymer composite as TIM was tested with 5W green LED employing thermal transient measurement technique. Comparing the filler to polymer ratio, the rise in junction temperature for 60 % Al filled composite was higher by 11.0 °C than 50 % Al filled composite at cured state. In addition, it was also observed from the structure function analysis that the total thermal resistance was 10.96 K/W higher for 60 % Al filled composite compared to 50 % Al filled composite. On the other hand, a significant rise of 9.46 °C in the junction temperature between cured and uncured samples of 50 % Al filled polymer TIM was observed and hence the importance of curing process of metal filled polymer composite for effective heat dissipation has been discussed extensively in this work.
机译:对高功率发光二极管(LED)的需求在照明行业中产生了戏剧性的革命。然而,尤其是LED的电子设备的小型化增加了对高度复杂但具有成本效益的热管理解决方案的需求,以维持这种技术进步。本文阐明了采用金属填充聚合物基质作为热界面材料(TIM)的LED的热行为,用于增强散热特性。高热导电铝掺入双酚A二缩水甘油醚(DGEBA)环氧基质中,以识别填料对高功率LED热性能的影响。 DGEBA的固化行为通过差示扫描量热法(DSC)和热重分析(TGA)进行了优化。用现场发射扫描电子显微镜(FESEM)验证了Al填料将Al填料分散性质。用5W绿色LED采用热瞬态测量技术,测试合成的Al填充聚合物复合材料的热性能。将填料与聚合物比进行比较,60%Al填充复合材料的结温的上升较高11.0°C,固化状态为50%填充的复合材料。此外,还从结构函数分析中观察到,与50%Al填充的复合材料相比,60%Al填充复合材料的总热阻为10.96k / w。另一方面,观察到50%Al填充聚合物Tim的固化和未固化样品之间的结温的显着升高为9.46℃,因此广泛讨论了用于有效散热的金属填充聚合物复合材料的固化过程的重要性在这项工作中。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号