With the development of the automotive electronics and other fields of electronic products toward the direction of miniaturization, high density, high reliability and low power consumption, the three-dimensional system-level packaging technology has become a new direction of technology development. In the three-dimensional system-level package, due to the need to stack a variety of chips, and the stack structure is complex, so it is difficult to control the process reliability. Therefore, it is necessary to analyze and verify the feasibility of the stacked-die ceramic packaging process in the field of automotive electronics. In this paper, several CSOP54 samples were prepared by sandwich stacked-die packaging structure to optimize the stacked-die ceramic packaging process. The samples were evaluated according to the series of environmental and reliability standards for automotive electronics (ISO 16750). And the results show that the process reliability can reach ISO 16750 related standards. If the use of the product environment on N_2, CO_2 and other internal atmosphere content have special requirements, it is necessary to consider further according to the experimental data of this paper.
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