etching; integrated circuit packaging; multichip modules; GQFN technology; IPC-JEDEC standards; UTAC grid array package; comprehensive package analysis; dense I-O counts; die attach paddle; etching process; flip chip; grid array QFN; lead frame package design; leadless lead-frame applications; multichip module; passive integration; solder balls; stacked die; standard laminate packages; Conferences; Electronics packaging;
机译:各种球栅阵列封装技术的热性能的分析比较
机译:高引脚数空腔向上增强塑料球栅阵列(EPBGA)封装的热性能比较
机译:高引脚数腔上增强型塑料球栅阵列(EPBGA)封装的热性能比较
机译:UTAC网格阵列封装(GQFN)的封装特性以及与标准层压封装的性能比较
机译:微波和毫米波针栅阵列和球栅阵列封装的开发。
机译:简化包装单页与非标准口服资料和标准包装单页的Nocebo效应:先导性随机对照试验
机译:球栅阵列电子包装多端口紧凑型热模型的热流体特性