GRID ARRAY-PLASTIC PACKAGE, MANUFACTURE THEREOF, PLASTIC LAMINATE USED FOR MANUFACTURING PACKAGE AND MANUFACTURE OF LAMINATE

摘要

PURPOSE: To enable execution of assembly with IS in a company for preparing a prototype speedily, by using a laminate comprising holes, a metal pattern and a grid pad array. ;CONSTITUTION: A preassembly 21 made up of a base sheet 22, a bonding sheet 23 and a structural member sheet 24 is prepared. It is put in a press and pressed and heated so that the sheets be overlaid on a single laminate, and the laminate wherein the sheets have a plurality of recessed holes is divided into a plurality of package units. Each package laminate is assembled with an IC unit 3 and the IC unit 3 is mounted on a metal bonding pad 14, while the metal bonding pad 14 is connected to a contact pad 18 on the bottom side of a plastic board 5. Accordingly, the IC unit 3 is connected electrically to a metal region 10 by a gold wire 17, and by sealing the holes with an appropriate protective material, a grid array-plastic package can be realized easily.;COPYRIGHT: (C)1995,JPO