An Interface Model of the Interconnection Between Integrated Circuit Chip Die and Printed Circuit Board

摘要

This work represents results obtained during research of high frequency IC packaging. The interface between IC die and PCB is described and its inner structure is developed: contact pads on IC die, bondwires and chip outputs. As an example of method developed the interface effects into device development and characteristics are shown for the LNA module as a part of the GPS receiver test chip.