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Two-dimensional Carrier Profiling with Sub-nm Resolution Using SSRM: From Basic Concept to TCAD Calibration and Device Tuning

机译:使用SSRM与子NM分辨率的二维载体分析:从基本概念到TCAD校准和设备调谐

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As the downscaling in semiconductor industry continues, the correct operation of CMOS-devices becomes extremely dependent on the precise location and activation of dopants in two dimensions. While for the previous (and thus less scaled) technologies enough information on dopant profiles could be gained from one-dimensional (ID) profile measurements (SRP and SIMS), two-dimensional (2D) measurement techniques are becoming essential to understand the intrinsic 2D nature of the devices and validate 2D process models.
机译:随着在半导体行业的较令人倾向的情况下,CMOS - 装置的正确操作变得极大地取决于两维的精确位置和激活掺杂剂。虽然对于以前(并且因此较少的缩放)技术可以从一维(ID)轮廓测量(SRP和SIMS)中获得有关掺杂剂配置文件的信息,但是二维(2D)测量技术正变得必不可少地理解内在的2D设备的性质和验证2D流程模型。

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