How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies

摘要

Due to the increase of microelectronic assemblies' complexity, the use of FEM simulations has become inescapable either for reliability prediction, or for virtual prototyping or qualification. This article will first describe the main reliability challenges linked to harsher environmental stresses, to new materials, to third dimension. Some examples taken from the current IMS lab studies, will illustrate the necessity of joint use of simulations and experiments.