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Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line

机译:虚拟原型设计,可靠性设计,以及FOWLP线的完整SIP产品组合的资格

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Low-Density Fan-Out (LDFO) (or Fan-out wafer-level-packaging) is a very popular technology for creating Systems in Package (SiP) designs. However, in reliability tests and in field use, cracks in the copper pads, in the redistribution layer (RDL) and in t
机译:低密度扇出(LDFO)(或扇出晶圆级包装)是一种非常流行的技术,用于在包装(SIP)设计中创建系统。 然而,在可靠性测试和现场使用中,在铜焊盘中裂缝,在再分配层(RDL)和T中

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