Fast reliability qualification of SiP products

摘要

For the purpose of rapidly identifying the functional weak points of SiP products and defining appropriate design rules, a new methodology is proposed to achieve fast reliability qualification. This new methodology is based on the moisture absorption behavior along the critical interface of a SiP carrier and on the most sensitive zone to delamination of the SiP carrier, determined by simulation and experimentally checked. In this paper, a new accelerated preconditioning is proposed and a new non destructive thermal method to monitor the delamination is presented. The effectiveness of this new stress test to accelerate the failure mechanism of the SiP carrier and the ability to detect delamination are evaluated by performing a DOE.