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Impact of VDMOS source metallization ageing in 3D FEM wire lift off modeling

机译:VDMOS源金属化老化在3D FEM线升降机上的影响

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摘要

Based on 3D FEM electro-thermal simulations, we explore the thermal impact of source metallization ageing inducing a bonding wire lift off on a VDMOS device. This kind of failure is usually modeled by changing the geometry of the assembly[1][2], without considering the physical properties evolution of aged materials such as the source metallization [3]. This work aims to highlight the importance of taking into account material evolution due to ageing in 3D FEM electro-thermal simulations.
机译:基于3D FEM电热模拟,我们探讨了源金属化老化在VDMOS器件上诱导粘接线升降的热冲击。这种故障通常通过改变组件的几何形状来建模[1] [2],而不考虑诸如源金属化的老化材料的物理性质演化[3]。这项工作旨在突出由于3D FEM电热模拟老化而考虑到物质演变的重要性。

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