Development of liquid, granule and sheet type epoxy molding compounds for fan out wafer/panel level package

摘要

Semiconductor market has still expanded and required more advanced and smaller package. To meet these requirements, FOWLP and/or Panel Level Package have marketed in recently. In this report, Liquid, Granule and Sheet materials were described as an encapsulation for FOWLP/Panel Level Package. Especially, warpage might be a key issue from the future standpoint for scaling up process and application. The discussion here touches the warpage issue for each material and process.