Grain size and orientation of microbump play very important roles on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.5Ag/Cu and Ni/Sn-2.5Ag/Ni microbumps assembled by thermal-compression bonding are investigated grain size and orientation by electron-backscattering diffraction inverse pole figure. Cu/Sn-2.5Ag/Cu microbumps appear much more single crystal-like structures than Ni/Sn-2.5Ag/Ni. By the distribution of grain size, a large quantity of the small Sn grains appears in Ni/Sn-2.5Ag/Ni microbump due to the very low solubility of Ni in Sn. Finally, Cu/Sn-2.5Ag/Cu microbumps possess more grain areas with the lower angles between c-axis and normal dirction.
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机译:Microbump的晶粒尺寸和方向在热循环试验和电迁移失效上发挥着非常重要的作用。在该研究中,通过热压缩键合组装的Cu / Sn-2.5Ag / Cu和Ni / Sn-2.5Ag / Ni Microbump通过电子 - 反向散射衍射逆极图进行了热压缩键合的晶粒尺寸和取向。 Cu / Sn-2.5ag / Cu microbumps显得比Ni / Sn-2.5ag / Ni更多的单晶结构。通过晶粒尺寸的分布,由于Ni在Sn中的溶解度非常低,因此在Ni / Sn-2.5ag / Ni Microbump中出现大量的小Sn晶粒。最后,Cu / Sn-2.5ag / Cu microbumps具有更多的谷物区域,其中C轴和正常的剪切之间具有较低的角度。
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