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A study on young's modulus of electroplated gold cantilevers for MEMS devices

机译:MEMS装置电镀金悬臂的杨氏模量研究

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This paper presents evaluation of the effective Young's modulus of electroplated gold micro-cantilevers. Young's modulus is one of the fundamental parameters to design MEMS (microelectromechanical systems) components. Gold electroplated MEMS structures can be used to develop highly-sensitive MEMS sensors, such as accelerometers. With a resonant frequency method, we evaluate gold-electroplated Ti/Au cantilevers by varying both the length and the width. The experimental results showed that the Young's modulus was dependent on the width, and it was found that the Young's modulus increased with an increase in the width, which would be useful to design MEMS devices.
机译:本文提出了对电镀金微悬臂的有效杨氏模量的评价。杨氏模量是设计MEMS(微机电系统)组件的基本参数之一。金电镀MEMS结构可用于开发高敏感的MEMS传感器,例如加速度计。通过谐振频率方法,通过改变长度和宽度,我们评估金电镀的Ti / Au悬臂。实验结果表明,杨氏模量依赖于宽度,并发现杨氏模量随着宽度的增加而增加,这对于设计MEMS器件是有用的。

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