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A study on young's modulus of electroplated gold cantilevers for MEMS devices

机译:MEMS器件电镀金悬臂的杨氏模量研究

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This paper presents evaluation of the effective Young's modulus of electroplated gold micro-cantilevers. Young's modulus is one of the fundamental parameters to design MEMS (microelectromechanical systems) components. Gold electroplated MEMS structures can be used to develop highly-sensitive MEMS sensors, such as accelerometers. With a resonant frequency method, we evaluate gold-electroplated Ti/Au cantilevers by varying both the length and the width. The experimental results showed that the Young's modulus was dependent on the width, and it was found that the Young's modulus increased with an increase in the width, which would be useful to design MEMS devices.
机译:本文提出了对电镀金微悬臂梁的有效杨氏模量的评估。杨氏模量是设计MEMS(微机电系统)组件的基本参数之一。镀金的MEMS结构可用于开发高灵敏度的MEMS传感器,例如加速度计。使用共振频率方法,我们通过改变长度和宽度来评估镀金的Ti / Au悬臂。实验结果表明,杨氏模量取决于宽度,并且发现杨氏模量随宽度的增加而增加,这将对设计MEMS器件很有用。

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