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Image Reconstruction Techniques for High Numerical Aperture Integrated Circuit Imaging

机译:高数值孔径集成电路成像的图像重建技术

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As feature sizes in integrated circuits (ICs) become smaller, higher-resolution defect detection and failure analysis techniques are required. The introduction of solid immersion lenses (SIL) has been an enabling technology for high-resolution backside IC imaging. High Numerical Aperture (NA) SIL imaging introduces properties of focused light which cannot be predicted by scalar beam optics. For example, spatial resolution can be manipulated in selected directions by modification of the polarization direction in linearly polarized light. In this work, we propose a unified framework combining multiple SIL microscopy images collected using polarizations at different directions in order to improve image reconstruction performance and ultimately resolution and defect localization. We show improvement in reconstruction quality by combining data taken using light with multiple polarizations. We demonstrate the effectiveness of our framework on experimental data.
机译:随着集成电路(IC)的特征尺寸变小,需要更高分辨率的缺陷检测和故障分析技术。固体浸没透镜(SIL)的引入已成为高分辨率背面IC成像的一项使能技术。高数值孔径(NA)SIL成像引入了标量光束光学器件无法预测的聚焦光的特性。例如,可以通过改变线性偏振光中的偏振方向来在选定的方向上操纵空间分辨率。在这项工作中,我们提出了一个统一的框架,该框架将使用不同方向的极化收集的多个SIL显微镜图像相结合,以提高图像重建性能,并最终改善分辨率和缺陷定位。通过结合使用具有多种偏振光的数据,我们显示了重建质量的提高。我们证明了我们的实验数据框架的有效性。

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