Scallop-Free Bosch Process

摘要

Study on through-silicon via (TSV) etch rate was carried outusing a time-multiplexed etch process. TSV etch rate andscallop size are affected by many process parameters, suchas plasma source power, bias power, gas flow rates, andpressure. Mask and device layers must be considered wheneliminating scallops during the Bosch etch process. It wasfound in this study that scallops can be virtually eliminatedwithout affecting other profile attributes or significantlyreducing overall productivity.