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Numerical Analysis of a Trench Gate FLIMOSFET with No Quasi-Saturation, Improved Specific On-Resistance and Better Synchronous Rectifying Characteristics

机译:没有准饱和度的沟槽门FlimosfeT的数值分析,改进了特定的导通电阻和更好的同步整流特性

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In this paper, we report a novel Trench gate FLIMOSFET structure designed using the concept of "Opposite Doped Buried Regions (ODBR) and floating island (FLIMOSFET) along with Trench-gate technology. The proposed device structure exhibits quasi-saturation free output and transconductance characteristics over a wide range of voltages as well as gives reduced on-resistance when compared with the conventional FLIMOSFET for two trench depths 2.5 and 3 microns. The new device structure does not give any degradation towards the breakdown voltage which remains almost constant at 65 volts. It also exhibit better synchronous rectifying characteristics.
机译:在本文中,我们报告了一种新颖的沟槽栅极絮凝体结构,使用“相反的掺杂埋地区(ODBR)和浮岛(FlimosfeT)以及沟槽栅极技术设计的概念。所提出的装置结构表现出准饱和输出和跨导与两个沟槽深度2.5和3微米相比,在传统的FlimosfeT相比,在宽范围内的电压上提供的特性。新的器件结构不会对击穿电压造成任何劣化,这在65伏特仍然存在几乎恒定的击穿电压。它还表现出更好的同步整流特性。

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