Copper lead frame with silver plated layer was widely used in the assembly industry and H2S (hydrogen sulfide) in air sulfurized the silver plated layer as well as formed Ag2S (silver sulfide) film which changed the surface topography of lead fingers and degraded the wire bonding ability. The control of storage environment and exposing time as well as the application of pre-wire-bonding plasma could bring benefits to the actual production.
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机译：镀银层的铜引线框架广泛用于组装行业，空气中的H 2 S（硫化氢）使镀银层硫化并形成Ag 2 S （硫化银）薄膜会改变铅指的表面形貌并降低引线键合能力。存储环境和曝光时间的控制以及预引线键合等离子体的应用可以为实际生产带来好处。
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