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A Generalized Model for Residual Stress Caused by Thermal Mismatch in Multilayer Structures

机译:多层结构热失配引起的残余应力的通用模型

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An analytical model based on multilayer structure with thermal expansion mismatch caused by temperature gradients was established to predict the residual stress in the system. The solution obtained from the model is independent of the number of layers. Three simplified models: bi-layer structure, coating system and film system with great compatibility are developed considering different engineering application. And the bilayer structure is verified by Stoney's equation under the same conditions. Tri-layer coating system ZrO_2/ Al_2O_3/1Cr_(18)Ni_9Ti is established in order to research the effect of temperature variations on the residual stress between different layers. The results suggested the stress has obvious mutation in coating interface with different temperature variation. And the residual stress with different temperature variation in different layers is larger than that with identical temperature variation.
机译:建立了一个基于多层结构的分析模型,该模型具有由温度梯度引起的热膨胀失配,以预测系统中的残余应力。从模型获得的解与层数无关。针对不同的工程应用,开发了三种简化模型:双层结构,涂层系统和膜系统,具有很好的兼容性。并在相同条件下通过Stoney方程对双层结构进行了验证。建立三层涂层体系ZrO_2 / Al_2O_3 / 1Cr_(18)Ni_9Ti,以研​​究温度变化对不同层之间残余应力的影响。结果表明,随着温度的变化,涂层界面的应力发生了明显的突变。而且,不同层中温度变化不同的残余应力要大于相同温度变化的残余应力。

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