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Processing and Electrical Properties of Ta and Li-modified KNN-based Lead-free Thin Films Prepared by the RF Sputtering Technology

机译:射频溅射技术制备的钽和锂改性的KNN基无铅薄膜的制备及电学性能

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Lead-free potassium sodium niobate ceramic thin films were synthesized using rf magnetron sputtering technology for MFIS structures. The optimal sputtering parameters of the as-deposited KNN thin films for depositing times of 1h were obtained. Regarding the measured physical properties, the micro-structure and thickness of as-deposited KNN thin films for different oxygen concentration were obtained and compared by XRD patterns and SEM images. The surface roughness of KNN thin film was also observed by AFM morphology. The average grain size and root mean square roughness were 250 and 7.04 nm, respectively. For KNN thin films in the MFIS structure, the capacitance and leakage current density were 280 pF and 10~(-8)A/cm~2, respectively. We investigated that the leakage current density and the memory window increased, the capacitance critically increased as the oxygen concentration increased from 0 to 40%. However, the excess oxygen concentration process was decreased the electrical and physical of as-deposited KNN thin film. The effect of oxygen concentration on the physical and electrical characteristics of KNN thin films was investigated and determined.
机译:利用射频磁控溅射技术制备了MFIS结构的无铅铌酸钾钠陶瓷薄膜。获得了沉积时间为1h的最佳KNN薄膜溅射参数。关于所测量的物理性质,获得了不同氧浓度的沉积的KNN薄膜的微观结构和厚度,并通过XRD图和SEM图像进行了比较。还通过AFM形态观察了KNN薄膜的表面粗糙度。平均晶粒尺寸和均方根粗糙度分别为250和7.04nm。对于MFIS结构的KNN薄膜,电容和漏电流密度分别为280 pF和10〜(-8)A / cm〜2。我们调查了泄漏电流密度和存储窗口的增加,电容随着氧气浓度从0%增加到40%而急剧增加。然而,过量的氧气浓缩过程降低了沉积的KNN薄膜的电学和物理性能。研究并确定了氧浓度对KNN薄膜的物理和电学特性的影响。

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