首页> 外文会议>ISPDI 2011;International symposium on photoelectronic detection and imaging >Fabrication of Vanadium Dioxide Polycrystalline Films with Higher Temperature Coefficient of Resistance
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Fabrication of Vanadium Dioxide Polycrystalline Films with Higher Temperature Coefficient of Resistance

机译:具有较高电阻温度系数的二氧化钒多晶膜的制备

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Vanadium Dioxide Polycrystalline Films with High Temperature Coefficient of Resistance(TCR) were fabricated by modified Ion Beam Enhanced Deposition(IBED) method. The TCR of the Un-doping VO_2 was about -4%/K at room temperature after appropriate thermal annealing. The XRD results clearly showed that IBED polycrystalline VO_2 films had a single [002] orientation of VO_2(M). The TCR of 5at.%W and 7at.% Ta doped Vanadium Dioxide Polycrystalline Films were high up to -18%/K and -12%/K at room temperature, respectively. Using 7at.% Ta and 2at.% Ti co-doping, the TCR of the co-dped vanadium oxide film was -7%/K and without hysteresis during temperature increasing and decresing from 0-80°C. It should indicate that the W-doped vanadium dioxide films colud be used for high sensing IR detect and the Ta/Ti co-doped film without hysteresis is suitable for infrarid imaging application.
机译:采用改进的离子束增强沉积(IBED)方法制备了具有高温电阻系数(TCR)的二氧化钒多晶膜。经过适当的热退火后,室温下未掺杂VO_2的TCR约为-4%/ K。 XRD结果清楚地表明IBED多晶VO_2薄膜具有VO_2(M)的单一[002]取向。掺杂5at。%W和7at。%Ta的二氧化钒多晶薄膜的TCR在室温下分别高达-18%/ K和-12%/ K。使用7at。%的Ta和2at。%的Ti共掺杂,共掺杂的钒氧化物薄膜的TCR为-7%/ K,并且在温度升高和从0-80°C降低时没有滞后现象。应当指出,掺W的二氧化钒薄膜可用于高感测红外检测,无滞后的Ta / Ti共掺杂薄膜适用于红外成像应用。

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