Simultaneous switching noise coupling through via transition for a CMOS negative feedback Operational Amplifier in System-in-Package

摘要

In this paper, a modeling method [1] is proposed to investigate the simultaneous switching noise coupling path and effects on the Operational Amplifier (Op-Amp). This method combines an analytical model and interconnection models for the chip-package co-modeling and co-analysis. CMOS Op-Amp is fabricated by TSMC 0.25um to validate the modeling method. It was successfully demonstrated by simulation and measurement with SSN noise, which has the frequency from 10MHz to 3GHz. It shows the necessity for the chip-package co-modeling and co-simulation of the System-In-Package (SIP).