Study on the thermal cycle and drop test reliability of system-in-packages with an Embedded die

摘要

Recently, the electronic components have been developed to be small and multifunctional. To meet this trend, system-in-Package (SiP) has been adapted as one of the core packaging technologies for many product applications. Among various types of SiPs, SiP packages with an embedded die have become important due to smaller size by embedded dies and better electrical performance by shorter interconnection length. However, the reliability data of SiP with an embedded die have not been reported yet. Therefore, it is necessary to investigate the reliability of SiPs with an embedded die and the effect of embedded die on the SiP reliability, especially thermal cycling (T/C) and drop reliability. Through this study, for the T/C test, it was found that the failure position of the BGA format SiP was changed from the corner solder ball position of the conventional BGA package, where the largest DNP (distance from neutral point) was, to inner BGA solder ball positions, where the edge of embedded die was located, due to its complicated structure of embedded die SiPs, but the embedded die didn't effect to drop reliability.