Yield and defect level prediction of designed printed circuit board assembly based on DPMO metric

摘要

In this paper a new prediction tool is presented, which can provide both yield and defect level predictions. The tool, which is based on DPMO (defects per million opportunities) metric, is intended for newly designed printed circuit board assemblies. It is programmed in Visual Basic for Application (VBA) and it can be operated in MS Excel environment. Yield prediction is based on so called the yield-DPMO model that is an extension of the yield prediction model, which was created in my dissertation and published in the paper [1]. The yield-DPMO model provides more outputs for quality planners then yield prediction model. The defect level prediction is based on the so called the “defect level-DPMO” model, which works on the basis of complexity based estimate, where from inputs data are determined the defect spectrums and tests coverage. The advantage of DPMO is the fact that it is fully comparable metric and it is not associated only with the certain manufacturing line. Thanks to this tool is possible to predict defect level, manufacturing yield, analyze and assess test strategy alternatives by using the estimated defects.