Thin Wafer Handling of 300mm Wafer for 3D IC Integration

摘要

In this study, thin wafer handling of 300mm wafer for 3D IC Integration is investigated. Emphasis is placed onthe determination of the effect of a dicing tape on thin-wafer handling of wafers with Cu-Au pads, Cu-Ni-Au UBM,and TSV interposer with RDL. Also, thin-wafer handling critical issues such as the chip/interposer wafer, carrierwafer, temporary bonding, thinning, backside process, de-bonding, and assembly are presented and their potentialsolutions are discussed. Finally, state-of-the-art of materials and equipments for thin-wafer handling are examined.