Developments in Stencil Printing Technology for 0.3mm Pitch CSP Assembly

摘要

As electronics assemblies continue to shrink in form factor, forcing designers towards smaller components withdecreasing pitches, the Surface Mount assembly process is becoming increasingly challenged.A new “active” squeegee printing process has been developed to assist in the stencil printing of solder pastes fornext generation ultra fine pitch components such as 0.3mm pitch CSP’s.Results indicate that today’s accepted stencil area ratio rules, which govern solder paste transfer efficiency can besignificantly pushed to extend stencil printing process capabilities to stencil apertures having area ratios as low as0.4. Such a breakthrough will allow the printing of ultra fine pitch components and additionally will assist withheterogeneous assembly concerns, to satisfy up and coming mixed technology demands.